Mentor Graphics Adds Support for Integrated Fan-Out (InFO) Packaging Technology at TSMC Integration of Calibre and Xpedition Platforms Provides Co-Verification Solution for InFO Design Applications

WILSONVILLE, Ore., March 14, 2016 /PRNewswire/ -- Mentor Graphics Corporation (NASDAQ: MENT) today announced a design, layout, and verification solution to support design applications for TSMC's Integrated Fan-Out (InFO) wafer-level packaging technology. The solution comprises the Calibre® nmDRC physical verification product, the Calibre RVE™ results viewing platform, and the Xpedition® Package Integrator flow. It enables mutual customers to deploy the unique fan-out layer structures and interconnects in the TSMC InFO technology, targeting...